- Out of stock
HyperX Fury Blue 4GB, DDR3, 1600MHz (PC3-12800) CL10 DIMM Memory
£33.09
VAT included
HyperX HX316C10F/4
4GB 512M x 64-Bit DDR3-1600 CL10 240-Pin DIMM
HyperX HX316C10F/4 is a 512M x 64-bit (4GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory module, based on eight 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3-1600 at a low latency timing of 10-10-10 at 1.5V.
Features
• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), single sided component
Description
Specification
- Series: Kingston HyperX Fury
- DDR Type: DDR3
- Size: 4GB
- Speed: 1600 MHz
- Compliance: PC3-12800
- Pins: 240-pin
- CAS Latency: CL10
- Data Integrity Check: Non-ECC
- Voltage: 1.5V
- Timings: 10-10-10-30
- Heatsink: Yes
- Package Type: Blister Pack
- Package Weight: 0.0500 kg
- Warranty: Lifetime
HX316C10F/4
Data sheet
- Warranty
- Lifetime
- DDR Type
- DDR3
- Package Type
- Blister Pack
- Package Weight
- 0.0500 kg
- Heatsink
- Yes
- Series
- Kingston HyperX Fury
- Size
- 4GB
- Speed
- 1600 MHz
- Compliance
- PC3-12800
- Pins
- 240-pin
- CAS Latency
- CL10
- Data Integrity Check
- Non-ECC
- Voltage
- 1.5V
- Timings
- 10-10-10-30
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HyperX HX316C10F/4
4GB 512M x 64-Bit DDR3-1600 CL10 240-Pin DIMM
HyperX HX316C10F/4 is a 512M x 64-bit (4GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory module, based on eight 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3-1600 at a low latency timing of 10-10-10 at 1.5V.
Features
• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), single sided component